The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Oct. 22, 2014
Amkor Technology, Inc., Chandler, AZ (US);
Hyung Il Jeon, Gyeonggi-do, KR;
Ji Young Chung, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
In Bae Park, Seoul, KR;
Jae Min Bae, Seoul, KR;
No Sun Park, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.