The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jan. 28, 2011
Applicants:

Shin-ichi Ogino, Ibaraki, JP;

Atsushi Sato, Ibaraki, JP;

Yuichiro Nakamura, Ibaraki, JP;

Atsutoshi Arakawa, Ibaraki, JP;

Inventors:

Shin-ichi Ogino, Ibaraki, JP;

Atsushi Sato, Ibaraki, JP;

Yuichiro Nakamura, Ibaraki, JP;

Atsutoshi Arakawa, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/18 (2006.01); C23C 14/34 (2006.01); C22C 1/04 (2006.01); C22C 19/07 (2006.01); C22C 32/00 (2006.01); C22F 1/10 (2006.01); G11B 5/851 (2006.01); H01F 10/16 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3407 (2013.01); C22C 1/0433 (2013.01); C22C 19/07 (2013.01); C22C 32/0026 (2013.01); C22F 1/10 (2013.01); C23C 14/3414 (2013.01); G11B 5/851 (2013.01); H01F 41/18 (2013.01); H01F 10/16 (2013.01);
Abstract

Provided is a sputtering target of ferromagnetic material comprising a metal having a composition containing 20 mol % or less of Cr, and Co as the remainder; wherein the target structure includes a phase (A) which is a basis metal, and metal phases (B) having a component composition different from the peripheral texture within the phase (A), the area ratio occupied by oxides within 1 μm from the most outer periphery of metal phases (B) is 80% or less, and the average grain size of the metal phases (B) is 10 μm or more and 150 μm or less. Provided is a sputtering target of ferromagnetic material capable of inhibiting the generation of particles during sputtering, and improving the pass-through flux to achieve a stable electrical discharge with a magnetron sputtering device.


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