The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Feb. 13, 2014
Applicant:

Intermolecular, Inc., San Jose, CA (US);

Inventors:

Haifan Liang, Fremont, CA (US);

Jeroen Van Duren, Palo Alto, CA (US);

Assignee:

Intermolecular, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/065 (2012.01); H01L 31/032 (2006.01); H01L 31/0749 (2012.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/065 (2013.01); H01L 21/02472 (2013.01); H01L 21/02485 (2013.01); H01L 21/02491 (2013.01); H01L 21/02502 (2013.01); H01L 21/02568 (2013.01); H01L 21/02614 (2013.01); H01L 31/0322 (2013.01); H01L 31/0326 (2013.01); H01L 31/0749 (2013.01); Y02E 10/541 (2013.01);
Abstract

Methods are described for forming CIGS absorber layers in TFPV devices with graded compositions and graded band gaps. Methods are described for utilizing Al to increase the band gap at the front surface of the absorber layer. Methods are described for forming a Cu—In—Ga layer followed by partial or full selenization. This results in a higher Ga concentration at the back interface. The substrate is then exposed to an aluminum CVD precursor while the substrate is still in the selenization equipment to deposit a thin Al layer. The substrate is then exposed to a Se source to fully convert the absorber layer. This results in a higher Al concentration at the front of the absorber.


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