The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jul. 05, 2012
Applicants:
Weiping Liu, New Hartford, NY (US);
Ning-cheng Lee, New Hartford, NY (US);
Inventors:
Weiping Liu, New Hartford, NY (US);
Ning-Cheng Lee, New Hartford, NY (US);
Assignee:
Indium Corporation, Clinton, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
C22C 13/00 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); C22C 13/02 (2013.01); Y10T 403/479 (2015.01);
Abstract
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.