The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Sep. 23, 2014
Applicant:
Sandisk 3d Llc, Milpitas, CA (US);
Inventors:
Thomas H. Lee, Cupertino, CA (US);
Vivek Subramanian, Redwood City, CA (US);
James M. Cleeves, Redwood City, CA (US);
Igor G. Kouznetsov, Santa Clara, CA (US);
Mark G. Johnson, Los Altos, CA (US);
Paul Michael Farmwald, Portola Valley, CA (US);
Assignee:
SANDISK 3D LLC, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/115 (2006.01); G11C 16/34 (2006.01); H01L 21/822 (2006.01); H01L 27/06 (2006.01); H01L 27/112 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 29/861 (2006.01); H01L 29/16 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11558 (2013.01); G11C 16/3427 (2013.01); H01L 21/8221 (2013.01); H01L 27/0688 (2013.01); H01L 27/112 (2013.01); H01L 27/115 (2013.01); H01L 27/11521 (2013.01); H01L 27/11526 (2013.01); H01L 27/11551 (2013.01); H01L 27/11556 (2013.01); H01L 27/11568 (2013.01); H01L 27/11573 (2013.01); H01L 27/11578 (2013.01); H01L 27/11582 (2013.01); H01L 27/1203 (2013.01); H01L 29/16 (2013.01); H01L 29/1604 (2013.01); H01L 29/42324 (2013.01); H01L 29/42332 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/7881 (2013.01); H01L 29/7889 (2013.01); H01L 29/792 (2013.01); H01L 29/7926 (2013.01); H01L 29/8616 (2013.01); G11C 2211/5612 (2013.01); H01L 27/1158 (2013.01); H01L 27/12 (2013.01);
Abstract
There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing.