The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jun. 19, 2014
International Business Machines Corporation, Armonk, NY (US);
Applied Materials, Incorporated, Santa Clara, CA (US);
Markus Brink, White Plains, NY (US);
Michael A Guillorn, Yorktown, NY (US);
Mark D Hoinkis, Fishkill, NY (US);
Eric A Joseph, White Plains, NY (US);
Hiroyuki Miyazoe, White Plains, NY (US);
Bang N. To, Millwood, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Applied Materials, Incorporated, Santa Clara, CA (US);
Abstract
A method for fabricating a plurality of conductive lines in an integrated circuit includes providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer, forming a spacer in a layer of the multi-layer structure residing above the layer of conductive metal, wherein the spacer is formed from a metal-containing atomic layer deposition material, and transferring a pattern from the spacer to the layer of conductive metal using a sidewall image transfer technique, wherein the transferring results in a formation of the plurality of conductive lines in the layer of conductive material.