The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Feb. 04, 2013
Ho-jin Lee, Seoul, KR;
Kyu-ha Lee, Yongin-si, KR;
Gilheyun Choi, Seoul, KR;
Yongsoon Choi, Yongin-si, KR;
Pil-kyu Kang, Anyang-si, KR;
Byung-lyul Park, Seoul, KR;
Hyunsoo Chung, Hwaseong-si, KR;
Ho-Jin Lee, Seoul, KR;
Kyu-ha Lee, Yongin-si, KR;
Gilheyun Choi, Seoul, KR;
YongSoon Choi, Yongin-si, KR;
Pil-Kyu Kang, Anyang-si, KR;
Byung-Lyul Park, Seoul, KR;
Hyunsoo Chung, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
In one embodiment, the method includes forming a conductive via structure in a base layer. The base layer has a first surface and a second surface, and the second surface is opposite the first surface. The method further includes removing the second surface of the base layer to expose the conductive via structure such that the conductive via structure protrudes from the second surface, and forming a first lower insulating layer over the second surface such that an end surface of the conductive via structure remains exposed by the first lower insulating layer.