logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9159662 B1

PDFFull Text
Date of Patent:
Oct. 13, 2015

Filed:

Jun. 19, 2014

Semiconductor structures having adhesion promoting layer in cavities

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shai Haimson, Qiryat-Gat, IL;

Avi Rozenblat, Qiryat-Gat, IL;

Dror Horvitz, Qiryat-Gat, IL;

Maor Rotlain, Qiryat-Gat, IL;

Rotem Drori, Qiryat-Gat, IL;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Dorsey & Whitney LLP

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/76846 (2013.01); H01L 21/76865 (2013.01); H01L 21/76877 (2013.01); H01L 23/485 (2013.01); H01L 2924/0002 (2013.01);
Abstract

High aspect ratio trenches may be filled with metal that grows more from the bottom than the top of the trench. As a result, the tendency to form seams or to close of the trench at the top during filling may be reduced in some embodiments. Material that encourages the growth of metal may be formed in the trench at the bottom, while leaving the region of the trench near the top free of such material to encourage growth upwardly from the bottom.

Find Patent Forward Citations

Haimson, Shai. (2015). Semiconductor structures having adhesion promoting layer in cavities (U.S. Patent No. 9159662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9159662

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…