The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Aug. 07, 2014
Disco Corporation, Tokyo, JP;
Iwatani Corporation, Osaka-shi, JP;
Sakae Matsuzaki, Tokyo, JP;
Takatoshi Masuda, Tokyo, JP;
Nozomi Maemoto, Tokyo, JP;
Yu Yoshino, Amagasaki, JP;
Takehiko Senoo, Osaka, JP;
Toshihiro Aida, Tokyo, JP;
Tomoya Biro, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A dividing method for a wafer includes a step of irradiating a laser beam along streets to form modified regions in an inside of a wafer, a step of dividing the wafer into individual chips beginning with starting points given by the modified regions, a step of placing a processing chamber in which the wafer is charged to a vacuum state and fill the processing chamber with inert gas, and a step of introducing etching gas into the processing chamber filled with the inert gas to etch side faces of the chips.