The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Jan. 07, 2014
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Chi-Hao Chiu, Hsinchu, TW;

Ming-Tsung Chen, Changhua County, TW;

Kun-Huang Chang, Hsinchu, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 2/10 (2006.01); H01G 9/15 (2006.01); H01G 9/00 (2006.01); H01G 9/052 (2006.01);
U.S. Cl.
CPC ...
H01G 2/10 (2013.01); H01G 9/0036 (2013.01); H01G 9/15 (2013.01); H01G 9/0029 (2013.01); H01G 9/052 (2013.01); Y10T 29/417 (2015.01);
Abstract

A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.


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