The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 21, 2011
Applicants:
Shyam Sundar Venkataraman, Ludwigshafen, DE;
Eason Yu-shen Su, New Taipei, TW;
Inventors:
Shyam Sundar Venkataraman, Ludwigshafen, DE;
Eason Yu-Shen Su, New Taipei, TW;
Assignee:
BASF SE, Ludwigshafen, DE;
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C03C 15/00 (2006.01); H01L 21/3105 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C03C 15/00 (2013.01); C09K 3/1409 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/31053 (2013.01);
Abstract
Provided is a process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a chemical mechanical polishing (CMP) composition which comprises: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of anionic phosphate or phosphonate as dispersing agent or charge reversal agent, (C) at least one type of surfactant, and (D) an aqueous medium.