The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Dec. 12, 2012
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Andrew Dennis Watson Carswell, Boise, ID (US);

Wayne Hai-Wei Huang, Boise, ID (US);

Siddartha Kondoju, Boise, ID (US);

Jin Lu, Boise, ID (US);

Suresh Ramakrishnan, Boise, ID (US);

Kozaburo Sakai, Boise, ID (US);

Sony Varghese, Boise, ID (US);

Andrey V. Zagrebelny, Eagan, MN (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31058 (2013.01); H01L 21/32125 (2013.01);
Abstract

A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.


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