The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153383 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 06, 2015

Filed:

Mar. 18, 2013
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Ming-Tsung Chen, Changhua County, TW;

Ching-Feng Lin, Hsinchu County, TW;

Assignee:

Apaq Technology Co., Ltd., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/008 (2006.01); H01G 4/228 (2006.01); H01G 9/00 (2006.01); H01G 9/012 (2006.01); H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0029 (2013.01); H01G 4/228 (2013.01); H01G 4/32 (2013.01); H01G 9/008 (2013.01); H01G 9/012 (2013.01); H01G 9/016 (2013.01); Y10T 29/302 (2015.01); Y10T 29/417 (2015.01);
Abstract

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.


Find Patent Forward Citations

Chen, Ming-Tsung. (2015). Winding-type solid electrolytic capacitor package structure without using a lead frame (U.S. Patent No. 9153383). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153383

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