The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Sep. 04, 2013
Applicant:
Kemet Electronics Corporation, Simpsonville, SC (US);
Inventors:
Steven C. Hussey, Simpsonville, SC (US);
Yuri Freeman, Simpsonville, SC (US);
Philip M. Lessner, Simpsonville, SC (US);
Qingping Chen, Simpsonville, SC (US);
Javaid Qazi, Simpsonville, SC (US);
Assignee:
KEMET Electronics Corporation, Simpsonville, SC (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01G 13/00 (2013.01); H01G 9/012 (2006.01); H01G 9/028 (2006.01); H01G 9/042 (2006.01); H01G 9/06 (2006.01); H01G 9/08 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 13/00 (2013.01); H01G 9/012 (2013.01); H01G 9/028 (2013.01); H01G 9/0425 (2013.01); H01G 9/06 (2013.01); H01G 9/08 (2013.01); B23K 2201/38 (2013.01); H01G 9/15 (2013.01);
Abstract
A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.