The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9147528 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 29, 2015

Filed:

Mar. 18, 2013
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Ming-Tsung Chen, Changhua County, TW;

Ching-Feng Lin, Hsinchu County, TW;

Assignee:

Apaq Technology Co., Ltd., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/012 (2006.01); H01G 4/228 (2006.01); H01G 9/15 (2006.01); H01G 9/00 (2006.01); H01G 4/232 (2006.01); H01G 9/10 (2006.01); H01G 9/008 (2006.01);
U.S. Cl.
CPC ...
H01G 9/151 (2013.01); H01G 4/232 (2013.01); H01G 9/0029 (2013.01); H01G 9/012 (2013.01); H01G 9/10 (2013.01); H01G 9/008 (2013.01); Y10T 29/417 (2015.01);
Abstract

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.


Find Patent Forward Citations

Chen, Ming-Tsung. (2015). Winding-type solid electrolytic capacitor package structure using a lead frame (U.S. Patent No. 9147528). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9147528

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…