The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Jan. 19, 2012
Applicants:
Ting-ying Chien, Hsinchu, TW;
Yi Hsun Chiu, Zhubei, TW;
Ching-hou Su, Hsinchu, TW;
Chyi-tsong NI, Hsinchu, TW;
Inventors:
Ting-Ying Chien, Hsinchu, TW;
Yi Hsun Chiu, Zhubei, TW;
Ching-Hou Su, Hsinchu, TW;
Chyi-Tsong Ni, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 23/10 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/019 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16235 (2013.01);
Abstract
A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.