The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Nov. 18, 2013
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Fatma Arzum Simsek-Ege, Boise, ID (US);

Aaron R. Wilson, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2006.01); H01L 29/49 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02164 (2013.01); H01L 21/02238 (2013.01); H01L 21/32051 (2013.01); H01L 27/10844 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 29/4966 (2013.01);
Abstract

Some embodiments include a method of fabricating integrated structures. A metal-containing material is formed over a stack of alternating first and second levels. An opening is formed through the metal-containing material and the stack. Repeating vertically-stacked electrical components are formed along the stack at sidewalls of the opening. Some embodiments include a method of forming vertically-stacked memory cells. Metal-containing material is formed over a stack of alternating silicon dioxide levels and conductively-doped silicon levels. A first opening is formed through the metal-containing material and the stack. Cavities are formed to extend into the conductively-doped silicon levels along sidewalls of the first opening. Charge-blocking dielectric and charge-storage structures are formed within the cavities to leave a second opening. Sidewalls of the second opening are lined with gate dielectric and then channel material is formed within the second opening.


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