The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Feb. 03, 2011
Applicants:

Mei Sun, Los Altos, CA (US);

Farhat Quli, Hayward, CA (US);

Earl Jensen, Santa Clara, CA (US);

Paul Arleo, San Francisco, CA (US);

Vaibhaw Vishal, Fremont, CA (US);

Inventors:

Mei Sun, Los Altos, CA (US);

Farhat Quli, Hayward, CA (US);

Earl Jensen, Santa Clara, CA (US);

Paul Arleo, San Francisco, CA (US);

Vaibhaw Vishal, Fremont, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01K 17/00 (2006.01); G01K 1/16 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01K 17/00 (2013.01); H01L 21/67248 (2013.01);
Abstract

A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.


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