The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Aug. 13, 2012
Applicants:

Naotsugu Hoshi, Portland, OR (US);

Noriyuki Kobayashi, Nirasaki, JP;

Inventors:

Naotsugu Hoshi, Portland, OR (US);

Noriyuki Kobayashi, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C23F 1/00 (2006.01); H01L 21/768 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76813 (2013.01); H01J 37/32926 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/76807 (2013.01); H01J 37/32091 (2013.01); H01L 21/76814 (2013.01);
Abstract

A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas.


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