The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Dec. 20, 2013
Applicant:

Renesas Electronics Corporation, Kawasaki, JP;

Inventors:

Masayuki Furumiya, Kawasaki, JP;

Yasutaka Nakashiba, Kawasaki, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 49/02 (2006.01); G01R 31/302 (2006.01); G01R 31/315 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); G01R 31/3025 (2013.01); G01R 31/315 (2013.01); H01L 24/06 (2013.01); H01L 22/14 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A semiconductor device, includes a first substrate having a main surface and a rear surface opposing to the main surface, a first circuit including a plurality of transistors formed over the main surface, a first insulating film formed over the main surface to cover the first circuit, a first inductor formed in the first insulating film over the main surface, the first inductor being electrically connected to the first circuit; and a bonding pad formed over the main surface, the bonding pad being located at a first area, the first inductor being located at a second area, the first area being different from the second area in a plan view, and a second substrate having a main surface, a rear surface opposing to the main surface and a second inductor formed over the main surface.


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