The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Oct. 13, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Wataru Kaneda, Nagano, JP;

Noriyoshi Shimizu, Nagano, JP;

Akio Rokugawa, Nagano, JP;

Kaori Yokota, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 24/17 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H01L 2224/16054 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.


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