The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

May. 30, 2013
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Shunqiang Gong, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Lei Wang, Singapore, SG;

Wei Liu, Singapore, SG;

Wanbing Yi, Singapore, SG;

Jens Oswald, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/4763 (2006.01); H01L 23/538 (2006.01); H01L 27/22 (2006.01); H01L 27/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 27/222 (2013.01); H01L 27/2463 (2013.01);
Abstract

Memory devices and methods for forming the device are disclosed. The device includes a substrate having an array surface and a non-array surface and a memory array having a plurality of memory cells interconnected by first conductors in a first direction and second conductors in a second direction. The memory array is disposed on the array surface of the substrate. The device further includes through silicon via (TSV) contacts disposed in the substrate. The TSV contacts extend from the array surface to the non-array surface, enabling electrical connections to the array from the non-array surface.


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