The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Oct. 25, 2013
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Jaydeb Goswami, Boise, ID (US);

Hung Ming Tsai, Boise, ID (US);

Duane M. Goodner, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); C23C 16/04 (2006.01); H01L 27/108 (2006.01); H01L 21/74 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53257 (2013.01); C23C 16/045 (2013.01); H01L 21/743 (2013.01); H01L 27/10876 (2013.01); H01L 27/10891 (2013.01); H01L 21/76877 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Some embodiments include methods of forming conductive structures. An electrically conductive material may be deposited with a first deposition method. The first deposition method has a first deposition rate and forms a first portion of a conductive structure. A second portion of the conductive structure may be formed by depositing the electrically conductive material with a second deposition method having a second deposition rate. The second deposition rate may be different from the first deposition rate by at least about a factor of 3. In some embodiments, a region of the conductive structure is utilized as a transistor gate of a DRAM cell. Some embodiments include semiconductor constructions.


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