The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Apr. 14, 2014
Applicant:

Aixtron, Inc., Fremont, CA (US);

Inventors:

Stephen E. Savas, Pleasanton, CA (US);

Carl Galewski, Santa Cruz, CA (US);

Allan B. Wiesnoski, Fremont, CA (US);

Sai Mantripragada, Fremont, CA (US);

Sooyun Joh, Fremont, CA (US);

Assignee:

Aixtron, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/503 (2006.01); C23C 16/24 (2006.01); C23C 16/26 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); C23C 16/54 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/503 (2013.01); C23C 16/24 (2013.01); C23C 16/26 (2013.01); C23C 16/345 (2013.01); C23C 16/40 (2013.01); C23C 16/401 (2013.01); C23C 16/407 (2013.01); C23C 16/4412 (2013.01); C23C 16/45504 (2013.01); C23C 16/45519 (2013.01); C23C 16/45591 (2013.01); C23C 16/466 (2013.01); C23C 16/50 (2013.01); C23C 16/545 (2013.01); H01J 37/32036 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01J 37/32449 (2013.01); H01J 37/32541 (2013.01); H01L 21/67069 (2013.01);
Abstract

Apparatus and method for plasma-based processing well suited for deposition, etching, or treatment of semiconductor, conductor or insulating films. Plasma generating units include one or more elongated electrodes on the processing side of a substrate and a neutral electrode proximate the opposite side of the substrate. Gases may be injected proximate a powered electrode which break down electrically and produce activated species that flow toward the substrate area. This gas then flows into an extended process region between powered electrodes and substrate, providing controlled and continuous reactivity with the substrate at high rates with efficient utilization of reactant feedstock. Gases are exhausted via passages between powered electrodes or electrode and divider.


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