The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
May. 28, 2013
Infineon Technologies Ag, Neubiberg, DE;
Anja Gissibl, Regensburg, DE;
Hermann Wendt, Regensburg, DE;
Thomas Fischer, Regensburg, DE;
Bernhard Weidgans, Bernhardswald, DE;
Gudrun Stranzl, Goedersdorf, AT;
Tobias Schmidt, Regensburg, DE;
Dietrich Bonart, Bad Abbach, DE;
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Abstract
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack disposed at a side of the semiconductor workpiece, the metallization layer stack including at least a first layer and a second layer disposed over the first layer, wherein the first layer contains a first material and the second layer contains a second material that is different from the first material; patterning the metallization layer stack, wherein patterning the metallization layer stack includes wet etching the first layer and the second layer by means of an etching solution that has at least substantially the same etching rate for the first material and the second material.