The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Dec. 06, 2013
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;
Shyh-Wei Cheng, Zhudong Township, TW;
Jui-Chun Weng, Taipei, TW;
Hsi-Cheng Hsu, Taichung, TW;
Chih-Yu Wang, Taichung, TW;
Chuan-Yi Ko, Hsinchu, TW;
Ji-Hong Chiang, Changhua, TW;
Chung-Hsien Hung, Zhubei, TW;
Hsin-Yu Chen, Hsinchu, TW;
Chih-Hsien Chen, Hsinchu, TW;
Yu-Mei Wu, Keelung, TW;
Jong Chen, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.