The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Jan. 10, 2011
Sameh Asaad, Yorktown Heights, NY (US);
Ralph E. Bellofatto, Yorktown Heights, NY (US);
Michael A. Blocksome, Rochester, MN (US);
Matthias A. Blumrich, Yorktown Heights, NY (US);
Peter Boyle, Yorktown Heights, NY (US);
Jose R. Brunheroto, Yorktown Heights, NY (US);
Dong Chen, Yorktown Heights, NY (US);
Chen-yong Cher, Yorktown Heights, NY (US);
George L. Chiu, Yorktown Heights, NY (US);
Norman Christ, Yorktown Heights, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Kristan D. Davis, Rochester, MN (US);
Gabor J. Dozsa, Yorktown Heights, NY (US);
Alexandre E. Eichenberger, Yorktown Heights, NY (US);
Noel A. Eisley, Yorktown Heights, NY (US);
Matthew R. Ellavsky, Rochester, MN (US);
Kahn C. Evans, Rochester, MN (US);
Bruce M. Fleischer, Yorktown Heights, NY (US);
Thomas W. Fox, Yorktown Heights, NY (US);
Alan Gara, Yorktown Heights, NY (US);
Mark E. Giampapa, Yorktown Heights, NY (US);
Thomas M. Gooding, Rochester, MN (US);
Michael K. Gschwind, Yorktown Heights, NY (US);
John A. Gunnels, Yorktown Heights, NY (US);
Shawn A. Hall, Yorktown Heights, NY (US);
Rudolf A. Haring, Yorktown Heights, NY (US);
Philip Heidelberger, Yorktown Heights, NY (US);
Todd A. Inglett, Rochester, MN (US);
Brant L. Knudson, Rochester, MN (US);
Gerard V. Kopcsay, Yorktown Heights, NY (US);
Sameer Kumar, Yorktown Heights, NY (US);
Amith R. Mamidala, Yorktown Heights, NY (US);
James A. Marcella, Rochester, MN (US);
Mark G. Megerian, Rochester, MN (US);
Douglas R. Miller, Rochester, MN (US);
Samuel J. Miller, Rochester, MN (US);
Adam J. Muff, Rochester, MN (US);
Michael B. Mundy, Rochester, MN (US);
John K. O'brien, Yorktown Heights, NY (US);
Kathryn M. O'brien, Yorktown Heights, NY (US);
Martin Ohmacht, Yorktown Heights, NY (US);
Jeffrey J. Parker, Rochester, MN (US);
Ruth J. Poole, Rochester, MN (US);
Joseph D. Ratterman, Rochester, MN (US);
Valentina Salapura, Yorktown Heights, NY (US);
David L. Satterfield, Tewksbury, MA (US);
Robert M. Senger, Yorktown Heights, NY (US);
Brian Smith, Rochester, MN (US);
Burkhard Steinmacher-burow, Boeblingen, DE;
William M. Stockdell, Rochester, MN (US);
Craig B. Stunkel, Yorktown Heights, NY (US);
Krishnan Sugavanam, Yorktown Heights, NY (US);
Yutaka Sugawara, Yorktown Heights, NY (US);
Todd E. Takken, Yorktown Heights, NY (US);
Barry M. Trager, Yorktown Heights, NY (US);
James L. Van Oosten, Rochester, MN (US);
Charles D. Wait, Rochester, MN (US);
Robert E. Walkup, Yorktown Heights, NY (US);
Alfred T. Watson, Rochester, MN (US);
Robert W. Wisniewski, Yorktown Heights, NY (US);
Peng Wu, Yorktown Heights, NY (US);
Sameh Asaad, Yorktown Heights, NY (US);
Ralph E. Bellofatto, Yorktown Heights, NY (US);
Michael A. Blocksome, Rochester, MN (US);
Matthias A. Blumrich, Yorktown Heights, NY (US);
Peter Boyle, Yorktown Heights, NY (US);
Jose R. Brunheroto, Yorktown Heights, NY (US);
Dong Chen, Yorktown Heights, NY (US);
Chen-Yong Cher, Yorktown Heights, NY (US);
George L. Chiu, Yorktown Heights, NY (US);
Norman Christ, Yorktown Heights, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Kristan D. Davis, Rochester, MN (US);
Gabor J. Dozsa, Yorktown Heights, NY (US);
Alexandre E. Eichenberger, Yorktown Heights, NY (US);
Noel A. Eisley, Yorktown Heights, NY (US);
Matthew R. Ellavsky, Rochester, MN (US);
Kahn C. Evans, Rochester, MN (US);
Bruce M. Fleischer, Yorktown Heights, NY (US);
Thomas W. Fox, Yorktown Heights, NY (US);
Alan Gara, Yorktown Heights, NY (US);
Mark E. Giampapa, Yorktown Heights, NY (US);
Thomas M. Gooding, Rochester, MN (US);
Michael K. Gschwind, Yorktown Heights, NY (US);
John A. Gunnels, Yorktown Heights, NY (US);
Shawn A. Hall, Yorktown Heights, NY (US);
Rudolf A. Haring, Yorktown Heights, NY (US);
Philip Heidelberger, Yorktown Heights, NY (US);
Todd A. Inglett, Rochester, MN (US);
Brant L. Knudson, Rochester, MN (US);
Gerard V. Kopcsay, Yorktown Heights, NY (US);
Sameer Kumar, Yorktown Heights, NY (US);
Amith R. Mamidala, Yorktown Heights, NY (US);
James A. Marcella, Rochester, MN (US);
Mark G. Megerian, Rochester, MN (US);
Douglas R. Miller, Rochester, MN (US);
Samuel J. Miller, Rochester, MN (US);
Adam J. Muff, Rochester, MN (US);
Michael B. Mundy, Rochester, MN (US);
John K. O'Brien, Yorktown Heights, NY (US);
Kathryn M. O'Brien, Yorktown Heights, NY (US);
Martin Ohmacht, Yorktown Heights, NY (US);
Jeffrey J. Parker, Rochester, MN (US);
Ruth J. Poole, Rochester, MN (US);
Joseph D. Ratterman, Rochester, MN (US);
Valentina Salapura, Yorktown Heights, NY (US);
David L. Satterfield, Tewksbury, MA (US);
Robert M. Senger, Yorktown Heights, NY (US);
Brian Smith, Rochester, MN (US);
Burkhard Steinmacher-Burow, Boeblingen, DE;
William M. Stockdell, Rochester, MN (US);
Craig B. Stunkel, Yorktown Heights, NY (US);
Krishnan Sugavanam, Yorktown Heights, NY (US);
Yutaka Sugawara, Yorktown Heights, NY (US);
Todd E. Takken, Yorktown Heights, NY (US);
Barry M. Trager, Yorktown Heights, NY (US);
James L. Van Oosten, Rochester, MN (US);
Charles D. Wait, Rochester, MN (US);
Robert E. Walkup, Yorktown Heights, NY (US);
Alfred T. Watson, Rochester, MN (US);
Robert W. Wisniewski, Yorktown Heights, NY (US);
Peng Wu, Yorktown Heights, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaOPS-scale computing, at decreased cost, power and footprint, and that allows for a maximum packaging density of processing nodes from an interconnect point of view. The Supercomputer exploits technological advances in VLSI that enables a computing model where many processors can be integrated into a single Application Specific Integrated Circuit (ASIC). Each ASIC computing node comprises a system-on-chip ASIC utilizing four or more processors integrated into one die, with each having full access to all system resources and enabling adaptive partitioning of the processors to functions such as compute or messaging I/O on an application by application basis, and preferably, enable adaptive partitioning of functions in accordance with various algorithmic phases within an application, or if I/O or other processors are underutilized, then can participate in computation or communication nodes are interconnected by a five dimensional torus network with DMA that optimally maximize the throughput of packet communications between nodes and minimize latency.