The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Jul. 30, 2014
Applicant:
Napra Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
NAPRA CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/522 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01); H01L 21/76879 (2013.01); H01L 23/49894 (2013.01);
Abstract
A wiring substrate includes a semiconductor substrate, an insulator and a plurality of columnar conductors. The insulator is made of an insulating material filled in a groove or hole provided in the semiconductor substrate. The plurality of columnar conductors are filled in grooves or holes provided in the insulator. The grooves or holes are arranged at a narrow pitch in a plane of the insulator. The insulating material has a Si—O bond obtained by reacting Si particles with an organic Si compound.