The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Oct. 31, 2014
Applicant:

Nanya Technology Corp., Tao-Yuan Hsien, TW;

Inventors:

Chun-I Hsieh, Taoyuan County, TW;

Chang-Rong Wu, New Taipei, TW;

Assignee:

NANYA TECHNOLOGY CORP., Gueishan Dist., Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 43/12 (2006.01); B82Y 25/00 (2011.01); B82Y 40/00 (2011.01); H01F 10/32 (2006.01); H01F 41/30 (2006.01); H01L 43/08 (2006.01); H01L 43/02 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); B82Y 25/00 (2013.01); B82Y 40/00 (2013.01); H01F 10/3254 (2013.01); H01F 41/308 (2013.01); H01L 43/08 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01);
Abstract

A magnetoresistive random access memory (MRAM) element includes a bottom electrode embedded in a first insulating layer; an annular reference layer in a first via hole of a second insulating layer on the first insulating layer, the annular reference layer being situated above the bottom electrode; a first gap fill material layer filling the first via hole; a barrier layer covering the annular reference layer, the second insulating layer and the first gap fill material layer; an annular free layer in a second via hole of a third insulating layer on the second insulating layer, the annular free layer being situated above the annular reference layer; and a top electrode stacked on the annular free layer.


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