The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Jul. 05, 2007
Applicants:

Hui Wang, Shanghai, CN;

Jian Wang, Shanghai, CN;

Yue MA, Shanghai, CN;

Chuan He, Shanghai, CN;

Inventors:

Hui Wang, Shanghai, CN;

Jian Wang, Shanghai, CN;

Yue Ma, Shanghai, CN;

Chuan He, Shanghai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/10 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); H01L 21/02052 (2013.01); H01L 21/02063 (2013.01); H01L 21/6704 (2013.01);
Abstract

An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.


Find Patent Forward Citations

Wang, Hui. (2015). Methods and apparatus for cleaning semiconductor wafers (U.S. Patent No. 9070723). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9070723

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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