The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jan. 12, 2013
Avalanche Technology Inc., Fremont, CA (US);
Yuchen Zhou, San Jose, CA (US);
Bernardo Sardinha, Gilroy, CA (US);
Rajiv Yadav Ranjan, San Jose, CA (US);
Ebrahim Abedifard, Sunnyvale, CA (US);
Roger Klas Malmhall, San Jose, CA (US);
Zihui Wang, Fremont, CA (US);
Yiming Huai, Pleasanton, CA (US);
Jing Zhang, Los Altos, CA (US);
Avalanche Technology, Inc., Fremont, CA (US);
Abstract
Chip packages are described with soft-magnetic shields that are included inside or attached externally to the package containing a MRAM chip. In one group of embodiments a single shield with vias for bonding wires is affixed to the surface of the MRAM chip having the contact pads. The limitation of shield to chip distance due to bonding wire is eliminated by VIA holes according to the invention which achieves minimal spacing between the shield and chip. A second shield without vias can be positioned on the opposite side of the chip from the first shield. In one group of embodiments a hardened ferro-fluid shield can be the only shield or the structure can include a shield with or without vias. One group of embodiments includes an external shield with vias for solder access to the package contact pads affixed to the outer surface of the package.