The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jun. 16, 2011
Applicants:
Soon Yoeng Tan, Singapore, SG;
Teck Jung Tang, Beacon, NY (US);
Ian D. Melville, Highland, NY (US);
Yelei Vianna Yao, Singapore, SG;
Yasushi Yamagata, Hopewell Juncion, NY (US);
Inventors:
Soon Yoeng Tan, Singapore, SG;
Teck Jung Tang, Beacon, NY (US);
Ian D. Melville, Highland, NY (US);
Yelei Vianna Yao, Singapore, SG;
Yasushi Yamagata, Hopewell Juncion, NY (US);
Assignees:
GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;
INTERNATIONAL BUSINESS MACHINES CORPORATION, New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 7/06 (2006.01); G06F 1/00 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5068 (2013.01); G06F 2217/66 (2013.01);
Abstract
Multi-Project Wafers includes a plurality of chiplets from different IP owners. Non-relevant chiplets are implemented with IP protection to inhibit IP disclosure of non-relevant IP owners.