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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9069008 B1

PDFFull Text
Date of Patent:
Jun. 30, 2015

Filed:

Dec. 05, 2012

Inspection apparatus for semiconductor devices and chuck stage for the inspection apparatus that is movable with respect to the front and back side electrodes

Applicant:

Kabushiki Kaisha Nihon Micronics, Musashino-shi, JP;

Inventors:

Katsuo Yasuta, Musashino, JP;

Hikaru Masuta, Musashino, JP;

Hideki Nei, Musashino, JP;

Assignee:

KABUSHIKI KAISHA NIHON MICRONICS, Musashino-Shi, Tokyo, JP;

Attorney:

Browdy and Neimark, PLLC

Primary Examiner:

Vinh Nguyen

Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0408 (2013.01); G01R 31/26 (2013.01); G01R 31/2865 (2013.01); G01R 1/06705 (2013.01); G01R 1/07307 (2013.01); G01R 31/2608 (2013.01); G01R 31/2648 (2013.01);
Abstract

An inspection apparatus is provided, which includes probes for front side electrodes, probes for back side electrodes, and a chuck stage. The probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage.

Find Patent Forward Citations

Yasuta, Katsuo. (2015). Inspection apparatus for semiconductor devices and chuck stage for the inspection apparatus that is movable with respect to the front and back side electrodes (U.S. Patent No. 9069008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9069008

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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