The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Sep. 13, 2011
Applicants:

Arun Virupaksha Gowda, Rexford, NY (US);

Donald Paul Cunningham, Dallas, TX (US);

Shakti Singh Chauhan, Niskayuna, NY (US);

Inventors:

Arun Virupaksha Gowda, Rexford, NY (US);

Donald Paul Cunningham, Dallas, TX (US);

Shakti Singh Chauhan, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H05K 1/18 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H05K 1/021 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/24 (2013.01);
Abstract

A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.


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