The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Dec. 20, 2012
Intel Corporation, Santa Clara, CA (US);
Sriram Srinivasan, Chandler, AZ (US);
Ram S. Viswanath, Phoenix, AZ (US);
Paul R. Start, Chandler, AZ (US);
Rajen S. Sidhu, Chandler, AZ (US);
Rajasekaran Swaminathan, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.