The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Jan. 08, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Hsin-Hui Lee, Kaohsiung, TW;
William Cheng, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/02 (2006.01); H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 25/50 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01);
Abstract
An integrated circuit structure includes a semiconductor chip having a die side and a non-die side, the die side having one or more trenches formed therein. The integrated circuit structure further includes at least one die bonded onto the die side of the semiconductor chip. The integrated circuit structure further includes a protecting material encapsulating the at least one die and substantially filling the one or more trenches.