The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jan. 10, 2013
International Business Machines Corporation, Armonk, NY (US);
Colin J. Brodsky, Salt Point, NY (US);
Anne C. Friedman, Fishkill, NY (US);
Herbert Lei Ho, New Windsor, NY (US);
Byeong Yeol Kim, Lagrangeville, NY (US);
Dan Mihai Mocuta, Lagrangeville, NY (US);
Garrett W. Oakley, Poughkeepsie, NY (US);
Chienfan Yu, Highland Mills, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Partial removal of organic planarizing layer (OPL) material forms a plug of OPL material within an aperture that protects underlying material or electronic device such as a deep trench capacitor during other manufacturing processes. The OPL plug thus can absorb any differences or non-uniformity in, for example, etch rates across the chip or wafer and preserve recess dimensions previously formed. Control of a lateral component of later removal of the OPL plug by etching also can increase tolerance of overlay error in forming connections and thus avoid loss in manufacturing yield.