The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jun. 21, 2011
Griselda Bonilla, Fishkill, NY (US);
Kaushik Chanda, Fishkill, NY (US);
Samuel S. Choi, Beacon, NY (US);
Ronald G. Filippi, Wappingers Falls, NY (US);
Stephan Grunow, Poughkeepsie, NY (US);
Naftali E. Lustig, Croton on Hudson, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Griselda Bonilla, Fishkill, NY (US);
Kaushik Chanda, Fishkill, NY (US);
Samuel S. Choi, Beacon, NY (US);
Ronald G. Filippi, Wappingers Falls, NY (US);
Stephan Grunow, Poughkeepsie, NY (US);
Naftali E. Lustig, Croton on Hudson, NY (US);
Andrew H. Simon, Fishkill, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
E-fuse structures in back end of the line (BEOL) interconnects and methods of manufacture are provided. The method includes forming an interconnect via in a substrate in alignment with a first underlying metal wire and forming an e-fuse via in the substrate, exposing a second underlying metal wire. The method further includes forming a defect with the second underlying metal wire and filling the interconnect via with metal and in contact with the first underlying metal wire thereby forming an interconnect structure. The method further includes filling the e-fuse via with the metal and in contact with the defect and the second underlying metal wire thereby forming an e-fuse structure.