The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Aug. 14, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Chun-Wen Cheng, Zhubei, TW;
Hsueh-An Yang, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B81C 1/00 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); H01L 23/02 (2013.01); B81C 2203/019 (2013.01); H01L 2924/0002 (2013.01); B81C 1/0038 (2013.01); B81C 2203/0118 (2013.01);
Abstract
One method includes providing a first substrate; the first substrate may include a first MEMS device and a second MEMS device. A second substrate is also provided. The first substrate is bonded to the second substrate. The bonding may include forming a first bond ring around the first MEMS device and forming a second bond ring around the second MEMS device, wherein the second bond ring also encircles the first bond ring. In an embodiment, the eutectic point of the materials of the second bond ring is not reached during the bonding.