The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Jun. 05, 2013
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Noriyoshi Shimizu, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Akihiko Tateiwa, Nagano, JP;
Masato Tanaka, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Abstract
A semiconductor device includes a semiconductor chip, a core substrate, first and second insulating layers, and first and second wiring layers. Adhesiveness of the insulating layer to a metal is higher than adhesiveness of the core substrate to the metal. A through hole extends through the insulating layer in the thickness direction. A through via covers the hole wall surface of the through hole, extends in the thickness direction traversing the insulating layer, and electrically connects the first and second wiring layers.