The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Feb. 29, 2012
Applicants:

Seiki Ishida, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Inventors:

Seiki Ishida, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01); G03C 5/00 (2006.01); G03F 7/20 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70341 (2013.01); H01L 21/0257 (2013.01); G03F 7/70525 (2013.01); G03F 7/70991 (2013.01);
Abstract

A coating and developing system for forming a resist film on a substrate by coating the substrate with a liquid resist and developing the resist film after the resist film has been processed by immersion exposure that forms a liquid layer on the surface of the substrate is capable of reducing difference in property among resist films formed on substrates. The coating and developing system includes: a cleaning unit; a carrying means; and a controller. A set time interval is determined such that the substrate is subjected to the immersion exposure process after contact angle drop rate at which contact angle between the cleaning liquid and a surface of the substrate drops has dropped from an initial level at the wetting time point when the surface of the substrate is wetted with the cleaning liquid to a level far lower than the initial level.


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