The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Mar. 11, 2013
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Pao-Tsung Lai, Tainan, TW;
Chia-Chiun Chen, Fengshan, TW;
Ching-Chung Cheng, Kaohsiung, TW;
Chi-Feng Chen, Tainan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
Provided is a physical vapor deposition apparatus with one or multiple deposition chambers for depositing films on substrates. The deposition chambers includes a heater and various cooling features to cool the chamber, the heater and the substrate. The sidewalls and top of the chamber are cooled by a cooling feature. The heater includes a cooling plate. A fitted heated cover is disposed between the heater and the substrate. A cooling pipe delivers a coolant throughout the cooling plate and extends in a high spatial density throughout the surface of the cooling plate. The cooling pipe occupies an area of about 14-20% of the area of the cooling plate and no location on the cooling plate surface is greater than about 15-20 mm from the cooling pipe. The cooling pipe cools the heater rapidly and enables deposition operations of long duration and using high power to be carried out.