The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Jun. 24, 2008
Applicants:

Javier Soto, Chandler, AZ (US);

Charan Gurumurthy, Gilbert, AZ (US);

Robert Nickerson, Chandler, AZ (US);

Debendra Mallik, Chandler, AZ (US);

Inventors:

Javier Soto, Chandler, AZ (US);

Charan Gurumurthy, Gilbert, AZ (US);

Robert Nickerson, Chandler, AZ (US);

Debendra Mallik, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/40 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 2924/1433 (2013.01); H05K 1/113 (2013.01); H05K 3/0035 (2013.01); H05K 3/007 (2013.01); H05K 3/20 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 3/3457 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/1536 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.


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