The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Mar. 10, 2011
Hyun-su Jun, Hwaseong-si, KR;
Ki-sang Kim, Seongnam-si, KR;
Seung-heong Lee, Suwon-si, KR;
Jong-bum Kim, Seoul, KR;
Min-woung Choi, Yongin-si, KR;
In-joong Kim, Seoul, KR;
Hyun-Su Jun, Hwaseong-si, KR;
Ki-Sang Kim, Seongnam-si, KR;
Seung-Heong Lee, Suwon-si, KR;
Jong-Bum Kim, Seoul, KR;
Min-Woung Choi, Yongin-si, KR;
In-Joong Kim, Seoul, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.