The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Mar. 30, 2012
Tsung-han Tsai, Zhunan Township, TW;
Jung-chi Jeng, Tainan, TW;
Yueh-ching Chang, Kaohsiung, TW;
Volume Chien, Sinying, TW;
Huang-ta Huang, Tainan, TW;
Chi-cherng Jeng, Madou Township, TW;
Tsung-Han Tsai, Zhunan Township, TW;
Jung-Chi Jeng, Tainan, TW;
Yueh-Ching Chang, Kaohsiung, TW;
Volume Chien, Sinying, TW;
Huang-Ta Huang, Tainan, TW;
Chi-Cherng Jeng, Madou Township, TW;
Abstract
A bonding pad structure includes a substrate and a first conductive island formed in a first dielectric layer and disposed over the substrate. A first via array having a plurality of vias is formed in a second dielectric layer and disposed over the first conductive island. A second conductive island is formed in a third dielectric layer and disposed over the first via array. A bonding pad is disposed over the second conductive island. The first conductive island, the first via array, and the second conductive island are electrically connected to the bonding pad. The first via array is connected to no other conductive island in the first dielectric layer except the first conductive island. No other conductive island in the third dielectric layer is connected to the first via array except the second conductive island.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile