The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Sep. 28, 2011
Applicants:

Shin-ya Minegishi, Tokyo, JP;

Shin-ya Nakafuji, Tokyo, JP;

Satoru Murakami, Tokyo, JP;

Toru Kimura, Tokyo, JP;

Inventors:

Shin-ya Minegishi, Tokyo, JP;

Shin-ya Nakafuji, Tokyo, JP;

Satoru Murakami, Tokyo, JP;

Toru Kimura, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/311 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); C08K 5/42 (2006.01); C08L 101/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); C08K 5/42 (2013.01); C08L 101/02 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01);
Abstract

Provided by the present invention is a method including: (1) forming a resist underlayer film on the upper face side of a substrate to be processed using a composition for forming a resist underlayer film, the composition containing (A) a compound having a group represented by the following formula (1); (2) forming a resist coating film by applying a resist composition on the resist underlayer film; (3) exposing the resist coating film by selectively irradiating the resist coating film with a radiation; (4) forming a resist pattern by developing the exposed resist coating film; and (5) forming a predetermined pattern on the substrate to be processed by sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.


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