The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

May. 19, 2011
Applicants:

Hitoshi Osaki, Tokyo, JP;

Yusuke Asano, Tokyo, JP;

Mitsuo Sato, Tokyo, JP;

Tomoki Nagai, Tokyo, JP;

Inventors:

Hitoshi Osaki, Tokyo, JP;

Yusuke Asano, Tokyo, JP;

Mitsuo Sato, Tokyo, JP;

Tomoki Nagai, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); C08F 22/18 (2006.01); C08F 220/26 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/20 (2006.01); C07C 69/653 (2006.01); C07C 69/753 (2006.01); C07D 307/93 (2006.01); C08F 24/00 (2006.01); C08F 220/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); C08F 220/24 (2013.01); C08F 220/26 (2013.01); G03F 7/0046 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/2041 (2013.01); C07C 69/653 (2013.01); C07C 69/753 (2013.01); C07D 307/93 (2013.01); C08F 22/18 (2013.01); C08F 24/00 (2013.01);
Abstract

A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a fluorine-containing polymer having a structural unit (I) that includes a group represented by the following formula (1), and (B) a radiation-sensitive acid generator.


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