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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9035465 B1

PDFFull Text
Expired
Date of Patent:
May. 19, 2015

Filed:

May. 09, 2014

Forming semiconductor chip connections

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kangguo Cheng, Schenectady, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Mukta G. Farooq, Hopewell Junction, NY (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

Louis L. Hsu, Fishkill, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

H. Daniel Schnurmann

Hoffman Warnick LLC

Primary Examiner:

Marvin Payen

Assistant Examiner:

Jeremy Joy

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/488 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01); H01L 27/02 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/6836 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06551 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/014 (2013.01); H01L 2224/131 (2013.01); H01L 2924/0001 (2013.01); H01L 2224/14183 (2013.01); H01L 27/0207 (2013.01); H01L 29/0657 (2013.01);
Abstract

Various embodiments include semiconductor structures. In one embodiment, the semiconductor structure includes a chip having a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.

Find Patent Forward Citations

Cheng, Kangguo. (2015). Forming semiconductor chip connections (U.S. Patent No. 9035465). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9035465

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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