The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Feb. 12, 2008
Applicants:
Weilin Gao, Iwata, JP;
Hisashi Suda, Iwata, JP;
Hiroto Narieda, Hamamatsu, JP;
Akira Sugawara, Iwata, JP;
Inventors:
Weilin Gao, Iwata, JP;
Hisashi Suda, Iwata, JP;
Hiroto Narieda, Hamamatsu, JP;
Akira Sugawara, Iwata, JP;
Assignee:
DOWA METALTECH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); C22F 1/08 (2013.01); H01R 13/03 (2013.01);
Abstract
This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1):{420}/{420}>1.0  (1),