The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Jan. 08, 2013
Applicant:

Semiconductor Manufacturing International Corp., Shanghai, CN;

Inventors:

Yong Chen, Shanghai, CN;

Yonggen He, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/314 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 29/66477 (2013.01); H01L 21/3141 (2013.01); H01L 21/02181 (2013.01); H01L 21/02205 (2013.01); H01L 21/0228 (2013.01); C23C 16/405 (2013.01); C23C 16/45553 (2013.01); H01L 21/28194 (2013.01); H01L 29/49 (2013.01); H01L 29/517 (2013.01); H01L 29/66575 (2013.01);
Abstract

A method is provided for fabricating a High-K layer. The method includes providing a substrate, applying a first precursor gas on the substrate such that the substrate absorbs first precursor gas molecules in a chemical absorption process, and removing the unabsorbed first precursor gas using a first inert gas. The method also includes applying a second precursor gas on the substrate, and forming a first thin film on the substrate as a reaction product of the second precursor gas and the absorbed first precursor gas molecules. Further, the method includes removing unreacted second precursor gas and byproducts using a second inert gas, and forming a high-K layer on the substrate by forming a plurality of the first thin films layer-by-layer.


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